The formula
I = J × A ; A_min = I_sc √t / k ; k = 226 √(ln((234.5 + θ_f)/(234.5 + θ_i)))
- J
- current density, A/mm² — 1.2–1.6 copper, 0.8–1.0 aluminium
- A
- bar section, width × thickness × bars per phase, mm²
- I_sc
- prospective symmetrical fault current, amperes
- t
- time the protective device takes to clear, seconds
- k
- IEC 60949 adiabatic constant — 122 for copper from 90 °C to 200 °C
Worked example
A 50 × 6 mm copper bar carrying 400 A, on a board with 25 kA prospective fault cleared in 1 s.
- Section = 50 × 6 = 300 mm²
- Density = 400 / 300 = 1.33 A/mm², inside the 1.2–1.6 band
- k for copper, 90 → 200 °C = 122.1
- A_min = 25 000 × √1 / 122.1 = 204.7 mm²
300 mm² passes both checks — 1.33 A/mm² continuous, against a 204.7 mm² fault minimum.
Where you'll use it
Laying out a panel or an LT switchboard, and checking whether an existing board still has the withstand it needs after the transformer feeding it was uprated. Current density is a design rule of thumb, not a rating: the real limit is the temperature rise the enclosure allows, and IEC 61439 type-tests the assembly as a whole.